EMI SHIELDING FOR ELECTRONIC PACKAGES

Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages. Cette i...

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Bibliographische Detailangaben
Hauptverfasser:	GAYNES, MICHAEL, ANTHONY, SABLINSKI, WILLIAM, EDWARD, INTERRANTE, MARIO, SPRING, CHRISTOPHER, TODD, HAMEL, HARVEY, CHARLES, ALCOE, DAVID, JAMES, COFFIN, JEFFREY, THOMAS, SHANNON, MEGAN, STUTZMAN, RANDALL, JOSEPH, PETERSON, BRENDA, LEE, WEISMAN, RENEE, ZITZ, JEFFREY, ALLEN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages. Cette invention concerne des ensembles électroniques avec blindage anti-interférence électromagnétique (EMI), et en particulier des structures porte-puces à semi-conducteur avec bandes de mise à la masse intégrées conçues pour réduire les émissions EMI sortantes ou incidentes pour des ensembles électroniques à commutation à grande vitesse.