SYSTEM AND METHOD FOR AUTOMATED MONITORING AND ASSESSMENT OF FABRICATION FACILITY
A method for monitoring and assessing operation of a semiconductor fabrication facility (800) comprises the steps of connecting a monitoring and assessment system (107) to a system bus (105) which is connected directly or indirectly to a manufacturing execution system (102) and a plurality of semico...
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| description | A method for monitoring and assessing operation of a semiconductor fabrication facility (800) comprises the steps of connecting a monitoring and assessment system (107) to a system bus (105) which is connected directly or indirectly to a manufacturing execution system (102) and a plurality of semiconductor fabrication tools. Through a user interface (820), the state models (815) can be configured for the semiconductor fabrication tools where each state model (815) is based upon a set of definned triggers (805) for each tool. During monitoring, various messages (803, 804) are transmitted on the system bus (105) between the semiconductor fabrication tools and the manufacturing execution system (102) and the monitoring and assessment system (107), and appropriate triggers are generated based upon the messages (803, 804) where the triggers are selected from a set of defined triggers (805). During operation, the state models (815) are updated for each tool affected by one of the triggers and transitions within the state models (815) are recorded in a tracking database (830).
A method for monitoring and assessing operation of a semiconductor fabrication facility comprises the steps of connecting a monitoring and assessment system to a system bus which is connected directly or indirectly to a manufacturing execution system and a plurality of semiconductor fabrication tools. Through a user interface, the state models can be configured for the semiconductor fabrication tools where each state model is based upon a set of definned triggers for each tool. During monitoring various messages are transmitted on the system bus between the semiconductor fabrication tools and the manufacturing execution system and the monitoring and assessment system, and appropriate triggers are generated based upon the messages where the triggers are selected from a set of defined triggers. During operation, the state models are updated for each tool affected by one of the triggers and transitions within the state models are recorded in a tracking database.
La présente invention concerne un procédé de contrôle et d'évaluation du fonctionnement d'une unité de fabrication de semi-conducteurs comportant des étapes de connexion d'un système de contrôle et d'évaluation à un système à bus qui est relié directement ou indirectement à un système d'exécution de fabrication et une pluralité d'outils de fabrication de semi-conducteurs. Par l'intermédiaire d'une interface d'utilisateur, les modèles à |
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A method for monitoring and assessing operation of a semiconductor fabrication facility comprises the steps of connecting a monitoring and assessment system to a system bus which is connected directly or indirectly to a manufacturing execution system and a plurality of semiconductor fabrication tools. Through a user interface, the state models can be configured for the semiconductor fabrication tools where each state model is based upon a set of definned triggers for each tool. During monitoring various messages are transmitted on the system bus between the semiconductor fabrication tools and the manufacturing execution system and the monitoring and assessment system, and appropriate triggers are generated based upon the messages where the triggers are selected from a set of defined triggers. During operation, the state models are updated for each tool affected by one of the triggers and transitions within the state models are recorded in a tracking database.
La présente invention concerne un procédé de contrôle et d'évaluation du fonctionnement d'une unité de fabrication de semi-conducteurs comportant des étapes de connexion d'un système de contrôle et d'évaluation à un système à bus qui est relié directement ou indirectement à un système d'exécution de fabrication et une pluralité d'outils de fabrication de semi-conducteurs. Par l'intermédiaire d'une interface d'utilisateur, les modèles à états peuvent être configurés pour les outils de fabrication de semi-conducteurs où chaque modèle est basé sur un ensemble de déclencheurs déterminés pour chaque outil. Lors du contrôle différents messages sont transmis sur le système à bus entre les outils de fabrication de semi-conducteurs et le système d'exécution et le système de contrôle et d'évaluation, et les déclencheurs appropriés sont générés sur la base des messages où les déclencheurs sont sélectionnés à partir d'un ensemble de déclencheurs déterminés. Lors de l'opération, les modèles à états sont mis à jour pour chaque outil attribué par un des déclencheurs et les transitions au sein des modèles à états sont enregistrés dans une base de données de suivi.</description><edition>7</edition><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ; CONTROL OR REGULATING SYSTEMS IN GENERAL ; CONTROLLING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS ; PHYSICS ; REGULATING ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020425&DB=EPODOC&CC=WO&NR=0233733A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020425&DB=EPODOC&CC=WO&NR=0233733A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHULZE, BRADLEY, D</creatorcontrib><title>SYSTEM AND METHOD FOR AUTOMATED MONITORING AND ASSESSMENT OF FABRICATION FACILITY</title><description>A method for monitoring and assessing operation of a semiconductor fabrication facility (800) comprises the steps of connecting a monitoring and assessment system (107) to a system bus (105) which is connected directly or indirectly to a manufacturing execution system (102) and a plurality of semiconductor fabrication tools. Through a user interface (820), the state models (815) can be configured for the semiconductor fabrication tools where each state model (815) is based upon a set of definned triggers (805) for each tool. During monitoring, various messages (803, 804) are transmitted on the system bus (105) between the semiconductor fabrication tools and the manufacturing execution system (102) and the monitoring and assessment system (107), and appropriate triggers are generated based upon the messages (803, 804) where the triggers are selected from a set of defined triggers (805). During operation, the state models (815) are updated for each tool affected by one of the triggers and transitions within the state models (815) are recorded in a tracking database (830).
A method for monitoring and assessing operation of a semiconductor fabrication facility comprises the steps of connecting a monitoring and assessment system to a system bus which is connected directly or indirectly to a manufacturing execution system and a plurality of semiconductor fabrication tools. Through a user interface, the state models can be configured for the semiconductor fabrication tools where each state model is based upon a set of definned triggers for each tool. During monitoring various messages are transmitted on the system bus between the semiconductor fabrication tools and the manufacturing execution system and the monitoring and assessment system, and appropriate triggers are generated based upon the messages where the triggers are selected from a set of defined triggers. During operation, the state models are updated for each tool affected by one of the triggers and transitions within the state models are recorded in a tracking database.
La présente invention concerne un procédé de contrôle et d'évaluation du fonctionnement d'une unité de fabrication de semi-conducteurs comportant des étapes de connexion d'un système de contrôle et d'évaluation à un système à bus qui est relié directement ou indirectement à un système d'exécution de fabrication et une pluralité d'outils de fabrication de semi-conducteurs. Par l'intermédiaire d'une interface d'utilisateur, les modèles à états peuvent être configurés pour les outils de fabrication de semi-conducteurs où chaque modèle est basé sur un ensemble de déclencheurs déterminés pour chaque outil. Lors du contrôle différents messages sont transmis sur le système à bus entre les outils de fabrication de semi-conducteurs et le système d'exécution et le système de contrôle et d'évaluation, et les déclencheurs appropriés sont générés sur la base des messages où les déclencheurs sont sélectionnés à partir d'un ensemble de déclencheurs déterminés. Lors de l'opération, les modèles à états sont mis à jour pour chaque outil attribué par un des déclencheurs et les transitions au sein des modèles à états sont enregistrés dans une base de données de suivi.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</subject><subject>CONTROL OR REGULATING SYSTEMS IN GENERAL</subject><subject>CONTROLLING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</subject><subject>PHYSICS</subject><subject>REGULATING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHvxIOof9gOCNAfPa7qxCyaL2RXpqRSJJ9FC_T8W8QGeZhhmWZ21U6MImBqIZK00ECQDXkwiGs1REptkTsfvg6qkGikZSICAh8wejSXN7vnE1q2rxX14TGXz46qCQObbbRlffZnG4Vae5d1fZVc7t3cOa_fH8gFVLS8d</recordid><startdate>20020425</startdate><enddate>20020425</enddate><creator>SCHULZE, BRADLEY, D</creator><scope>EVB</scope></search><sort><creationdate>20020425</creationdate><title>SYSTEM AND METHOD FOR AUTOMATED MONITORING AND ASSESSMENT OF FABRICATION FACILITY</title><author>SCHULZE, BRADLEY, D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO0233733A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</topic><topic>CONTROL OR REGULATING SYSTEMS IN GENERAL</topic><topic>CONTROLLING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</topic><topic>PHYSICS</topic><topic>REGULATING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHULZE, BRADLEY, D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHULZE, BRADLEY, D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM AND METHOD FOR AUTOMATED MONITORING AND ASSESSMENT OF FABRICATION FACILITY</title><date>2002-04-25</date><risdate>2002</risdate><abstract>A method for monitoring and assessing operation of a semiconductor fabrication facility (800) comprises the steps of connecting a monitoring and assessment system (107) to a system bus (105) which is connected directly or indirectly to a manufacturing execution system (102) and a plurality of semiconductor fabrication tools. Through a user interface (820), the state models (815) can be configured for the semiconductor fabrication tools where each state model (815) is based upon a set of definned triggers (805) for each tool. During monitoring, various messages (803, 804) are transmitted on the system bus (105) between the semiconductor fabrication tools and the manufacturing execution system (102) and the monitoring and assessment system (107), and appropriate triggers are generated based upon the messages (803, 804) where the triggers are selected from a set of defined triggers (805). During operation, the state models (815) are updated for each tool affected by one of the triggers and transitions within the state models (815) are recorded in a tracking database (830).
A method for monitoring and assessing operation of a semiconductor fabrication facility comprises the steps of connecting a monitoring and assessment system to a system bus which is connected directly or indirectly to a manufacturing execution system and a plurality of semiconductor fabrication tools. Through a user interface, the state models can be configured for the semiconductor fabrication tools where each state model is based upon a set of definned triggers for each tool. During monitoring various messages are transmitted on the system bus between the semiconductor fabrication tools and the manufacturing execution system and the monitoring and assessment system, and appropriate triggers are generated based upon the messages where the triggers are selected from a set of defined triggers. During operation, the state models are updated for each tool affected by one of the triggers and transitions within the state models are recorded in a tracking database.
La présente invention concerne un procédé de contrôle et d'évaluation du fonctionnement d'une unité de fabrication de semi-conducteurs comportant des étapes de connexion d'un système de contrôle et d'évaluation à un système à bus qui est relié directement ou indirectement à un système d'exécution de fabrication et une pluralité d'outils de fabrication de semi-conducteurs. Par l'intermédiaire d'une interface d'utilisateur, les modèles à états peuvent être configurés pour les outils de fabrication de semi-conducteurs où chaque modèle est basé sur un ensemble de déclencheurs déterminés pour chaque outil. Lors du contrôle différents messages sont transmis sur le système à bus entre les outils de fabrication de semi-conducteurs et le système d'exécution et le système de contrôle et d'évaluation, et les déclencheurs appropriés sont générés sur la base des messages où les déclencheurs sont sélectionnés à partir d'un ensemble de déclencheurs déterminés. Lors de l'opération, les modèles à états sont mis à jour pour chaque outil attribué par un des déclencheurs et les transitions au sein des modèles à états sont enregistrés dans une base de données de suivi.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PHYSICS REGULATING SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE |
| title | SYSTEM AND METHOD FOR AUTOMATED MONITORING AND ASSESSMENT OF FABRICATION FACILITY |
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