ARRANGEMENT FOR POLISHING DISK-LIKE OBJECTS
A polish head (3) for Chemical Mechanical Polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | GLASHAUSER, WALTER EBNER, KATRIN |
| description | A polish head (3) for Chemical Mechanical Polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The invention provides a uniform polishing of a semiconductor wafer (4).
L'invention concerne une tête de polissage (3) pour polissage mécano-chimique comportant un film support (5) en silicone sur un élément de support rigide (6,7), de préférence en céramique amorphe. Le film support (5) en silicone est fabriqué par moulage, ce qui lui donne une forme transversale adaptée aux besoins spécifiques du polissage. L'invention a trait à un polissage uniforme d'une plaquette à semi-conducteur (4). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO0226443A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO0226443A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO0226443A13</originalsourceid><addsrcrecordid>eNrjZNB2DApy9HN39XX1C1Fw8w9SCPD38Qz28PRzV3DxDPbW9fH0dlXwd_JydQ4J5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8eH-BkZGZiYmxo6GxkQoAQAwViSV</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ARRANGEMENT FOR POLISHING DISK-LIKE OBJECTS</title><source>esp@cenet</source><creator>GLASHAUSER, WALTER ; EBNER, KATRIN</creator><creatorcontrib>GLASHAUSER, WALTER ; EBNER, KATRIN</creatorcontrib><description>A polish head (3) for Chemical Mechanical Polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The invention provides a uniform polishing of a semiconductor wafer (4).
L'invention concerne une tête de polissage (3) pour polissage mécano-chimique comportant un film support (5) en silicone sur un élément de support rigide (6,7), de préférence en céramique amorphe. Le film support (5) en silicone est fabriqué par moulage, ce qui lui donne une forme transversale adaptée aux besoins spécifiques du polissage. L'invention a trait à un polissage uniforme d'une plaquette à semi-conducteur (4).</description><edition>7</edition><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020404&DB=EPODOC&CC=WO&NR=0226443A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020404&DB=EPODOC&CC=WO&NR=0226443A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GLASHAUSER, WALTER</creatorcontrib><creatorcontrib>EBNER, KATRIN</creatorcontrib><title>ARRANGEMENT FOR POLISHING DISK-LIKE OBJECTS</title><description>A polish head (3) for Chemical Mechanical Polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The invention provides a uniform polishing of a semiconductor wafer (4).
L'invention concerne une tête de polissage (3) pour polissage mécano-chimique comportant un film support (5) en silicone sur un élément de support rigide (6,7), de préférence en céramique amorphe. Le film support (5) en silicone est fabriqué par moulage, ce qui lui donne une forme transversale adaptée aux besoins spécifiques du polissage. L'invention a trait à un polissage uniforme d'une plaquette à semi-conducteur (4).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB2DApy9HN39XX1C1Fw8w9SCPD38Qz28PRzV3DxDPbW9fH0dlXwd_JydQ4J5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8eH-BkZGZiYmxo6GxkQoAQAwViSV</recordid><startdate>20020404</startdate><enddate>20020404</enddate><creator>GLASHAUSER, WALTER</creator><creator>EBNER, KATRIN</creator><scope>EVB</scope></search><sort><creationdate>20020404</creationdate><title>ARRANGEMENT FOR POLISHING DISK-LIKE OBJECTS</title><author>GLASHAUSER, WALTER ; EBNER, KATRIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO0226443A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>GLASHAUSER, WALTER</creatorcontrib><creatorcontrib>EBNER, KATRIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GLASHAUSER, WALTER</au><au>EBNER, KATRIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ARRANGEMENT FOR POLISHING DISK-LIKE OBJECTS</title><date>2002-04-04</date><risdate>2002</risdate><abstract>A polish head (3) for Chemical Mechanical Polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The invention provides a uniform polishing of a semiconductor wafer (4).
L'invention concerne une tête de polissage (3) pour polissage mécano-chimique comportant un film support (5) en silicone sur un élément de support rigide (6,7), de préférence en céramique amorphe. Le film support (5) en silicone est fabriqué par moulage, ce qui lui donne une forme transversale adaptée aux besoins spécifiques du polissage. L'invention a trait à un polissage uniforme d'une plaquette à semi-conducteur (4).</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO0226443A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | ARRANGEMENT FOR POLISHING DISK-LIKE OBJECTS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T19%3A15%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GLASHAUSER,%20WALTER&rft.date=2002-04-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO0226443A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |