ARRANGEMENT FOR POLISHING DISK-LIKE OBJECTS

A polish head (3) for Chemical Mechanical Polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific...

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Bibliographische Detailangaben
Hauptverfasser:	GLASHAUSER, WALTER, EBNER, KATRIN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A polish head (3) for Chemical Mechanical Polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The invention provides a uniform polishing of a semiconductor wafer (4). L'invention concerne une tête de polissage (3) pour polissage mécano-chimique comportant un film support (5) en silicone sur un élément de support rigide (6,7), de préférence en céramique amorphe. Le film support (5) en silicone est fabriqué par moulage, ce qui lui donne une forme transversale adaptée aux besoins spécifiques du polissage. L'invention a trait à un polissage uniforme d'une plaquette à semi-conducteur (4).