OPTICAL ARRAY CHIP PACKAGES WITH PASSIVE ALIGNMENT FEATURES

An adhesive layer (14) is applied to the surface of a flat, transparent flexible circuit that contains electrically conductive traces one, or more, electronic components is secured by the adhesive layer (14) to the flexible circuit (10). A dam (24) is formed that encircles at least a substantial por...

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Bibliographische Detailangaben

Hauptverfasser:	KORNRUMPF, WILLIAM, P, FORMAN, GLENN, A, KRYSAK, CHARLES, J, HENNESSY, WILLIAM, A
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS
Online-Zugang:	Volltext bestellen
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