BONDING TOOL WITH POLYMER COATING

A bonding tool (300) for bonding a wire to a substrate. The bonding tool (300) has a body portion (302), a working tip coupled to one end of the body portion (302), an orifice extending along a longitudinal axis of the body (302) and the working tip, and a polymer coating (320) disposed over at leas...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ROBINZON, SIGALIT, SONNENREICH, BENJAMIN
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A bonding tool (300) for bonding a wire to a substrate. The bonding tool (300) has a body portion (302), a working tip coupled to one end of the body portion (302), an orifice extending along a longitudinal axis of the body (302) and the working tip, and a polymer coating (320) disposed over at least a portion of a surface of the orifice. A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice. L'invention concerne un outil pour connexion permettant de relier un fil à un substrat. Cet outil pour connexion comporte une partie corps, une pointe de travail couplée à une extrémité de la partie corps, un orifice s'étendant le long d'un axe longitudinal du corps et de la pointe de travail, ainsi qu'un revêtement polymère disposé sur au moins une partie d'une surface de l'orifice.