FLEXIBLE PRINTED WIRING BOARD

A flexible printed wiring board composed of: an electrolytic copper foil which has not undergone surface roughening; a zinc-based metallic layer deposited on the electrolytic copper foil in an amount of 0.25 to 0.40 mg/dm ; and a polyimide resin layer formed on the zinc-based metallic layer by imidi...

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Bibliographische Detailangaben
Hauptverfasser:	TAKABAYASHI, ASAEI, KUDO, NORIAKI, SUZUKI, AKITOSHI, FUKUDA, SHIN
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A flexible printed wiring board composed of: an electrolytic copper foil which has not undergone surface roughening; a zinc-based metallic layer deposited on the electrolytic copper foil in an amount of 0.25 to 0.40 mg/dm ; and a polyimide resin layer formed on the zinc-based metallic layer by imidizing a polyamic acid layer. L'invention concerne une carte de circuits imprimés flexible composée d'une feuille de cuivre électrolytique qui n'a pas été soumise à un traitement permettant de rendre sa surface rugueuse, une couche métallique à base de zinc déposée sur la feuille de cuivre électrolytique dans une quantité comprise entre 0,25 et 0,40 mg/dm , et une couche de résine polyimide formée sur la couche métallique à base de zinc par imidification d'une couche d'acide polyamique.