A MEMORY EXPANSION MODULE WITH STACKED MEMORY PACKAGES

A memory expansion module with stacked memory packages. A memory module is implemented using stacked memory packages. Each of the stacked memory packages contains multiple memory chips, typically DRAMs (dynamic random access memory). The memory may be organized into multiple banks, wherein a given m...

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Bibliographische Detailangaben

Hauptverfasser:	ROBINSON, JAY, JEFFREY, DAVID, WONG, TAYUNG, CARRILLO, JOHN, VAIDYA, NIKHIL, FANG, CLEMENT, MITTY, NAGARAJ
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS STATIC STORES
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