HERMETIC SEALING OF TARGET/BACKING PLATE ASSEMBLIES USING ELECTRON BEAM MELTED INDIUM OR TIN

A method of sealing the edge of a solder bonded target assembly by heating the edge of the solder bond line to locally melt the solder. The target assembly is rotated to move the molten bead continuously around the assembly a full 360 degrees. The local melting of the solder may be acomplished throu...

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Bibliographische Detailangaben
Hauptverfasser:	HEIMANSON, DORIAN, SMATHERS, DAVID, B, GUTKIN, MICHAEL
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method of sealing the edge of a solder bonded target assembly by heating the edge of the solder bond line to locally melt the solder. The target assembly is rotated to move the molten bead continuously around the assembly a full 360 degrees. The local melting of the solder may be acomplished through the use of an electron beam welder in a vacuum. L'invention concerne un procédé relatif au scellement de la bordure d'un ensemble cible scellé par soudage, qui consiste à chauffer la bordure de la ligne de soudage aux fins de fusion locale. On soumet ensuite l'ensemble cible à une rotation pour déplacer le bourrelet fondu en continu autour de l'ensemble sur 360 degrés. Ladite fusion locale peut être effectuée sous vide à l'aide d'une machine de soudage par bombardement électronique.