PROCESSES AND APPARATUS FOR RECOVERY AND REMOVAL TIN, LEAD AND/OR COPPER FROM SOLUTIONS

The present invention provides novel processes and apparatus for recovery (10) of tin, lead and copper from a solution, particularly, spent stripper solutions (12) from printed circuit board manufacture. In one aspect, preferred systems of the invention can be characterized at least in part by enabl...

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Bibliographische Detailangaben
Hauptverfasser:	BAINS, NARINDER, SINGH, MORSE, GARY, KELLNER, P., ROD, GOOSEY, MARTIN, SOOR, JACK
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PRETREATMENT OF RAW MATERIALS PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY ORREFINING OF METALS PRODUCTION AND REFINING OF METALS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	The present invention provides novel processes and apparatus for recovery (10) of tin, lead and copper from a solution, particularly, spent stripper solutions (12) from printed circuit board manufacture. In one aspect, preferred systems of the invention can be characterized at least in part by enabling the recovery of each of tin, lead and copper from solutions containing those metals in a single-pass or closed-loop manner. L'invention concerne de nouveaux procédés et appareil de récupération (10) de l'étain, du plomb et du cuivre contenus dans une solution, en particulier, dans des solutions de décapage usées (12) provenant de la fabrication de plaque de circuit imprimé. Selon un aspect, les systèmes préférés peuvent être caractérisés, du moins en partie, en ce qu'ils permettent de récupérer chaque métal, étain, plomb et cuivre, des solutions qui contiennent ces métaux en une seule opération ou en boucle fermée.