Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device

A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side....

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Bibliographische Detailangaben
Hauptverfasser:	Tang, Xiaohong, Marzano, Thomas, Frysz, Christine A, Woods, Jason, Seitz, Keith W, Stevenson, Robert A, Brendel, Richard L, Thiebolt, William C, Frustaci, Dominck J, Winn, Steven W
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CONVERSION OR DISTRIBUTION OF ELECTRIC POWER CURRENT COLLECTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRICITY ELECTROTHERAPY FERROUS OR NON-FERROUS ALLOYS GENERATION HUMAN NECESSITIES HYGIENE INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES LINE CONNECTORS MACHINE TOOLS MAGNETOTHERAPY MEDICAL OR VETERINARY SCIENCE METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS RADIATION THERAPY SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS ULTRASOUND THERAPY WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.