Apparatus and methods for high pressure leaching of polycrystalline diamond cutter elements

A method for leaching a PCD table for a cutter element includes (a) positioning a PCD table within a leaching chamber. The method also includes (b) submerging the PCD table in an acid within the leaching chamber. In addition, the method includes (c) sealing the leaching chamber. Further, the method...

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Bibliographische Detailangaben
Hauptverfasser:	Streater, James R, Parker, Adondria M, Ghansyam, Haresh, Gilleylen, Russell, Zhan, Guodong, Donald, Sean
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL EARTH DRILLING EARTH DRILLING, e.g. DEEP DRILLING FIXED CONSTRUCTIONS GRINDING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MINING MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POLISHING THEIR RELEVANT APPARATUS TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for leaching a PCD table for a cutter element includes (a) positioning a PCD table within a leaching chamber. The method also includes (b) submerging the PCD table in an acid within the leaching chamber. In addition, the method includes (c) sealing the leaching chamber. Further, the method includes (d) increasing the pressure within the leaching chamber to a pressure greater than or equal to 20,000 psi after (c).