Electronic component metal material and method for manufacturing the same

There are provided an electronic component metal material having low insertability/extractability, low whisker formability and high durability, and a method for manufacturing the electronic component metal material. The electronic component metal material 10 includes a base material 11, an A layer 1...

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Bibliographische Detailangaben
Hauptverfasser:	Kodama, Atsushi, Fukamachi, Kazuhiko, Shibuya, Yoshitaka
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CURRENT COLLECTORS ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LINE CONNECTORS METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	There are provided an electronic component metal material having low insertability/extractability, low whisker formability and high durability, and a method for manufacturing the electronic component metal material. The electronic component metal material 10 includes a base material 11, an A layer 14 constituting an outermost surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer) 14 has a thickness larger than 0.2 μm, and the middle layer (B layer) 13 has a thickness of 0.001 μm or larger.