Electronic component and method for manufacturing the same
An electronic component includes a package substrate, an electronic component element mounted on the package substrate and includes an element substrate, a support layer, and a cover member, and a mold resin layer provided on the package substrate so as to seal the electronic component element. The...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An electronic component includes a package substrate, an electronic component element mounted on the package substrate and includes an element substrate, a support layer, and a cover member, and a mold resin layer provided on the package substrate so as to seal the electronic component element. The cover member includes a first cover member provided on the package substrate and a second cover member provided on the first cover member. The glass transition temperature of a resin material of the first cover member is higher than that of a resin material of the second cover member. |
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