Apparatus and method of treating a substrate

Provided are an apparatus and a method of treating a substrate using process gas. The apparatus may include a chamber configured to provide a treatment space, in which a process of treating a substrate is performed, a detection unit configured to detect an amount of reaction by-products attached on...

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Bibliographische Detailangaben
Hauptverfasser:	Kim, Hyun Joong, Park, Wan-Jae, Woo, Hyung Je, Han, Kyu Young, Ham, Yong-Hyun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Provided are an apparatus and a method of treating a substrate using process gas. The apparatus may include a chamber configured to provide a treatment space, in which a process of treating a substrate is performed, a detection unit configured to detect an amount of reaction by-products attached on an inner surface of the chamber. The detection unit may include a window member provided on the inner surface of the chamber, and a light source member configured to emit and receive light through the window member.