Earphone packaging
A package for an electronic device is disclosed. The package includes a first layer of compressed natural fibers defining an aperture and a second layer of compressed natural fibers disposed adjacent to the first layer of compressed natural fibers. The aperture is configured to receive a portion of...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A package for an electronic device is disclosed. The package includes a first layer of compressed natural fibers defining an aperture and a second layer of compressed natural fibers disposed adjacent to the first layer of compressed natural fibers. The aperture is configured to receive a portion of the electronic device. The second layer of compressed natural fibers has a flap partially covering the aperture defined by the first layer of compressed natural fibers. The first and second layers of compressed natural fibers are bonded to each other by high-frequency welding. |
---|