Earphone packaging

A package for an electronic device is disclosed. The package includes a first layer of compressed natural fibers defining an aperture and a second layer of compressed natural fibers disposed adjacent to the first layer of compressed natural fibers. The aperture is configured to receive a portion of...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Tang, Lorraine Y, Pincus, Derek Bowman
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A package for an electronic device is disclosed. The package includes a first layer of compressed natural fibers defining an aperture and a second layer of compressed natural fibers disposed adjacent to the first layer of compressed natural fibers. The aperture is configured to receive a portion of the electronic device. The second layer of compressed natural fibers has a flap partially covering the aperture defined by the first layer of compressed natural fibers. The first and second layers of compressed natural fibers are bonded to each other by high-frequency welding.