Hot melt adhesive composition with ethylene/α-olefin multi-block copolymer

The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/α-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90° C. to 150° C.; and c) a wax.

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Bibliographische Detailangaben
Hauptverfasser:	Rickey, Cynthia L, LiPiShan, Colin, Wang, Alex Y
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/α-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90° C. to 150° C.; and c) a wax.