Interior material for thin film deposition device and method for manufacturing same

An internal member for an apparatus of depositing a conductive thin film includes a chamber structure including a object supporting unit supporting an object on which the conductive thin film is to be deposited, and a target supporting unit supporting a target for depositing the conductive thin film...

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Bibliographische Detailangaben
Hauptverfasser:	Jang, Sung Soo, Ko, Hyun Chul, Jang, Kyung Ic, Choi, Sung Jin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An internal member for an apparatus of depositing a conductive thin film includes a chamber structure including a object supporting unit supporting an object on which the conductive thin film is to be deposited, and a target supporting unit supporting a target for depositing the conductive thin film on the object, wherein the target including a first metal material the chamber structure having a reaction space therein and a coating structure formed on an inner surface of the chamber structure, the inner surface being indirectly exposed to the reaction space of the chamber structure via the coating structure, and the coating structure including a second metal material having at least one metal element in the first metal material.