Substrate treatment apparatus and substrate treatment method

In accordance with an embodiment, a substrate treatment apparatus includes a housing, a magnetic field generating portion and a microwave supply portion. The housing is configured to contain a substrate comprising a conductive layer and an insulating film in contact with the conductive layer. The ma...

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Bibliographische Detailangaben
1. Verfasser:	Isogai, Tatsunori
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	In accordance with an embodiment, a substrate treatment apparatus includes a housing, a magnetic field generating portion and a microwave supply portion. The housing is configured to contain a substrate comprising a conductive layer and an insulating film in contact with the conductive layer. The magnetic field generating portion is configured to generate a magnetic field which penetrates the substrate. The microwave supply portion is configured to generate a microwave to heat the substrate, to apply the microwave to the substrate provided in the magnetic field in such a manner that the microwave is absorbed by unpaired electrons at an interface between the conductive layer and the insulating film or in the insulating film.