Caulking adhesive

An epoxy caulking adhesive, including: a component A and a component B. The component A at least includes the following components in parts by weight: between 50 and 100 parts of an epoxy resin, between 0 and 100 part(s) of an inorganic filler, between 0 and 20 part(s) of a thickener. The component...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Du, Kunwen, Lei, Qiong, Du, Kunwu, Wang, Yunfei
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An epoxy caulking adhesive, including: a component A and a component B. The component A at least includes the following components in parts by weight: between 50 and 100 parts of an epoxy resin, between 0 and 100 part(s) of an inorganic filler, between 0 and 20 part(s) of a thickener. The component B at least includes the following components in parts by weight: between 20 and 100 parts of an amine curing agent, between 0 and 150 part(s) of the inorganic filler, and between 0 and 25 part(s) of the thickener. The weight ratio of the component A to the component B is between 1:1 and 10:1. At least one of the inorganic filler and the thickener exists in both the component A and the component B.