Substrate processing apparatus

In a substrate processing apparatus, a shield plate includes a first chucking magnetic material (441). The shield plate is moved up and down by a chamber opening-and-closing mechanism. A substrate holding part includes a movable chuck member (412) and a fixed chuck member. The movable chuck member (...

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Bibliographische Detailangaben
Hauptverfasser:	Kikumoto, Noriyuki, Honsho, Kazuhiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BORING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING TURNING
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Beschreibung
Zusammenfassung:	In a substrate processing apparatus, a shield plate includes a first chucking magnetic material (441). The shield plate is moved up and down by a chamber opening-and-closing mechanism. A substrate holding part includes a movable chuck member (412) and a fixed chuck member. The movable chuck member (412) includes a second chucking magnetic material (442). When the shield plate is moved down, the shield plate comes in close proximity to the upper surface of a substrate (9), and the first chucking magnetic material (441) comes in close proximity to the second chucking magnetic material (442). The substrate (9) is held by magnetic action between the first chucking magnetic material (441) and the second chucking magnetic material (442). It is thus possible to hold the substrate (9) with a simple structure.