Electronic device and method for manufacturing same

Electronic device and method for manufacturing same

In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constitutin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Imaizumi Norihisa, Fukuda Tasuke, Sanada Yuuki, Nakama Keitarou, Uchibori Shinya, Oka Kengo, Takenaka Masayuki
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.