Method for patterning a microstructure

The invention relates to a method for patterning one or more portions of a microstructure comprised of a flexible substrate, a conductor disposed on the substrate, and a metal layer disposed on the conductor, wherein the conductor is comprised of a stack of a first and a second transparent conductiv...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Sebastian Muthu, Dolezal Michael W
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention relates to a method for patterning one or more portions of a microstructure comprised of a flexible substrate, a conductor disposed on the substrate, and a metal layer disposed on the conductor, wherein the conductor is comprised of a stack of a first and a second transparent conductive oxide (TCO) layer, and a metal doped silicon oxide layer sandwiched between the two TCO layers.