Printed circuit board and method of manufacturing the same

The object of the present invention is to provide a printed circuit board formed with a cavity to mount a semiconductor chip.

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Bibliographische Detailangaben
Hauptverfasser:	Lim Hyun Duck, Lee Yong Jik, Sung Jung Kyung, Koo Bong Wan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The object of the present invention is to provide a printed circuit board formed with a cavity to mount a semiconductor chip.