Use of vacuum chucks to hold a wafer or wafer sub-stack

Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.

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Bibliographische Detailangaben
Hauptverfasser: Heimgartner Stephan, Vidallon John A, Rudmann Hartmut
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.