Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device

A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive...

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Bibliographische Detailangaben
Hauptverfasser:	Marzano Thomas, Woods Jason, Winn Steven W, Tang Xiaohong, Brendel Richard L, Stevenson Robert A, Seitz Keith W, Thiebolt William C, Frysz Christine A, Frustaci Dominick J
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY CURRENT COLLECTORS ELECTRICITY ELECTROTHERAPY FERROUS OR NON-FERROUS ALLOYS HUMAN NECESSITIES HYGIENE LINE CONNECTORS MAGNETOTHERAPY MEDICAL OR VETERINARY SCIENCE METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL RADIATION THERAPY THEIR RELEVANT APPARATUS TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS ULTRASOUND THERAPY
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Beschreibung
Zusammenfassung:	A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.