Packaging of LED chips and driver circuit on the same substrate

The purpose of the present invention is to reduce the size and thickness of an LED module. The LED module includes a circuit substrate, at least two supply terminals, a plurality of LED dies, a plurality of FET die, a constant current circuit, a dam member, a fluorescent resin, a resistor network, a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ochiai Yuki, Arai Hidekazu, Watanabe Shigehisa, Akiyama Takashi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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