Packaging of LED chips and driver circuit on the same substrate

The purpose of the present invention is to reduce the size and thickness of an LED module. The LED module includes a circuit substrate, at least two supply terminals, a plurality of LED dies, a plurality of FET die, a constant current circuit, a dam member, a fluorescent resin, a resistor network, and a bypass circuit, wherein the constant current circuit includes one of the plurality of FET die and the bypass circuit includes other of the plurality of FET die, a portion of the dam enclosing the LED block region forms a portion of the dam enclosing the circuit block region, and the dam member enclosing the LED block region has a annular shape and the dam member enclosing the circuit block region has a rectangular shape except for said portion of the dam member.