Packaging of LED chips and driver circuit on the same substrate
The purpose of the present invention is to reduce the size and thickness of an LED module. The LED module includes a circuit substrate, at least two supply terminals, a plurality of LED dies, a plurality of FET die, a constant current circuit, a dam member, a fluorescent resin, a resistor network, a...
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| creator | Ochiai Yuki Arai Hidekazu Watanabe Shigehisa Akiyama Takashi |
| description | The purpose of the present invention is to reduce the size and thickness of an LED module. The LED module includes a circuit substrate, at least two supply terminals, a plurality of LED dies, a plurality of FET die, a constant current circuit, a dam member, a fluorescent resin, a resistor network, and a bypass circuit, wherein the constant current circuit includes one of the plurality of FET die and the bypass circuit includes other of the plurality of FET die, a portion of the dam enclosing the LED block region forms a portion of the dam enclosing the circuit block region, and the dam member enclosing the LED block region has a annular shape and the dam member enclosing the circuit block region has a rectangular shape except for said portion of the dam member. |
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The LED module includes a circuit substrate, at least two supply terminals, a plurality of LED dies, a plurality of FET die, a constant current circuit, a dam member, a fluorescent resin, a resistor network, and a bypass circuit, wherein the constant current circuit includes one of the plurality of FET die and the bypass circuit includes other of the plurality of FET die, a portion of the dam enclosing the LED block region forms a portion of the dam enclosing the circuit block region, and the dam member enclosing the LED block region has a annular shape and the dam member enclosing the circuit block region has a rectangular shape except for said portion of the dam member.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180206&DB=EPODOC&CC=US&NR=9887185B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180206&DB=EPODOC&CC=US&NR=9887185B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ochiai Yuki</creatorcontrib><creatorcontrib>Arai Hidekazu</creatorcontrib><creatorcontrib>Watanabe Shigehisa</creatorcontrib><creatorcontrib>Akiyama Takashi</creatorcontrib><title>Packaging of LED chips and driver circuit on the same substrate</title><description>The purpose of the present invention is to reduce the size and thickness of an LED module. The LED module includes a circuit substrate, at least two supply terminals, a plurality of LED dies, a plurality of FET die, a constant current circuit, a dam member, a fluorescent resin, a resistor network, and a bypass circuit, wherein the constant current circuit includes one of the plurality of FET die and the bypass circuit includes other of the plurality of FET die, a portion of the dam enclosing the LED block region forms a portion of the dam enclosing the circuit block region, and the dam member enclosing the LED block region has a annular shape and the dam member enclosing the circuit block region has a rectangular shape except for said portion of the dam member.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAPSEzOTkzPzEtXyE9T8HF1UUjOyCwoVkjMS1FIKcosSy1SSM4sSi7NLFHIz1MoyUhVKE7MBRKlScUlRYklqTwMrGmJOcWpvFCam0HBzTXE2UM3tSA_PrW4IDE5NS-1JD402NLCwtzQwtTJyJgIJQC-LS_t</recordid><startdate>20180206</startdate><enddate>20180206</enddate><creator>Ochiai Yuki</creator><creator>Arai Hidekazu</creator><creator>Watanabe Shigehisa</creator><creator>Akiyama Takashi</creator><scope>EVB</scope></search><sort><creationdate>20180206</creationdate><title>Packaging of LED chips and driver circuit on the same substrate</title><author>Ochiai Yuki ; Arai Hidekazu ; Watanabe Shigehisa ; Akiyama Takashi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9887185B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Ochiai Yuki</creatorcontrib><creatorcontrib>Arai Hidekazu</creatorcontrib><creatorcontrib>Watanabe Shigehisa</creatorcontrib><creatorcontrib>Akiyama Takashi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ochiai Yuki</au><au>Arai Hidekazu</au><au>Watanabe Shigehisa</au><au>Akiyama Takashi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Packaging of LED chips and driver circuit on the same substrate</title><date>2018-02-06</date><risdate>2018</risdate><abstract>The purpose of the present invention is to reduce the size and thickness of an LED module. 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Packaging of LED chips and driver circuit on the same substrate |
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