Methods and systems for solid state heat transfer

Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a f...

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Bibliographische Detailangaben
Hauptverfasser:	Lam Tung T, Yuan Sidney W. K
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING WEAPONS
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Beschreibung
Zusammenfassung:	Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.