Method of forming aligned pattern in pattern formation region by using imprint process
A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substra...
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| creator | Bae Jihyun Lee Sunghoon Yoon Ilsun Hahm Sukgyu Kim Dongouk Chung Jaeseung Park Joonyong Shin Bongsu Ok Jong G |
| description | A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9855703B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9855703B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9855703B23</originalsourceid><addsrcrecordid>eNrjZAjzTS3JyE9RyE9TSMsvys3MS1dIzMlMz0tNUShILClJLcpTyMyDM0FKEksy8_MUilLTQVRSpUJpMUhTZm5BUWZeiUJBUX5yanExDwNrWmJOcSovlOZmUHBzDXH20E0tyI9PLS5ITE7NSy2JDw22tDA1NTcwdjIyJkIJAM_xOb4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of forming aligned pattern in pattern formation region by using imprint process</title><source>esp@cenet</source><creator>Bae Jihyun ; Lee Sunghoon ; Yoon Ilsun ; Hahm Sukgyu ; Kim Dongouk ; Chung Jaeseung ; Park Joonyong ; Shin Bongsu ; Ok Jong G</creator><creatorcontrib>Bae Jihyun ; Lee Sunghoon ; Yoon Ilsun ; Hahm Sukgyu ; Kim Dongouk ; Chung Jaeseung ; Park Joonyong ; Shin Bongsu ; Ok Jong G</creatorcontrib><description>A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180102&DB=EPODOC&CC=US&NR=9855703B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,782,887,25573,76557</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180102&DB=EPODOC&CC=US&NR=9855703B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Bae Jihyun</creatorcontrib><creatorcontrib>Lee Sunghoon</creatorcontrib><creatorcontrib>Yoon Ilsun</creatorcontrib><creatorcontrib>Hahm Sukgyu</creatorcontrib><creatorcontrib>Kim Dongouk</creatorcontrib><creatorcontrib>Chung Jaeseung</creatorcontrib><creatorcontrib>Park Joonyong</creatorcontrib><creatorcontrib>Shin Bongsu</creatorcontrib><creatorcontrib>Ok Jong G</creatorcontrib><title>Method of forming aligned pattern in pattern formation region by using imprint process</title><description>A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAjzTS3JyE9RyE9TSMsvys3MS1dIzMlMz0tNUShILClJLcpTyMyDM0FKEksy8_MUilLTQVRSpUJpMUhTZm5BUWZeiUJBUX5yanExDwNrWmJOcSovlOZmUHBzDXH20E0tyI9PLS5ITE7NSy2JDw22tDA1NTcwdjIyJkIJAM_xOb4</recordid><startdate>20180102</startdate><enddate>20180102</enddate><creator>Bae Jihyun</creator><creator>Lee Sunghoon</creator><creator>Yoon Ilsun</creator><creator>Hahm Sukgyu</creator><creator>Kim Dongouk</creator><creator>Chung Jaeseung</creator><creator>Park Joonyong</creator><creator>Shin Bongsu</creator><creator>Ok Jong G</creator><scope>EVB</scope></search><sort><creationdate>20180102</creationdate><title>Method of forming aligned pattern in pattern formation region by using imprint process</title><author>Bae Jihyun ; Lee Sunghoon ; Yoon Ilsun ; Hahm Sukgyu ; Kim Dongouk ; Chung Jaeseung ; Park Joonyong ; Shin Bongsu ; Ok Jong G</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9855703B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>Bae Jihyun</creatorcontrib><creatorcontrib>Lee Sunghoon</creatorcontrib><creatorcontrib>Yoon Ilsun</creatorcontrib><creatorcontrib>Hahm Sukgyu</creatorcontrib><creatorcontrib>Kim Dongouk</creatorcontrib><creatorcontrib>Chung Jaeseung</creatorcontrib><creatorcontrib>Park Joonyong</creatorcontrib><creatorcontrib>Shin Bongsu</creatorcontrib><creatorcontrib>Ok Jong G</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bae Jihyun</au><au>Lee Sunghoon</au><au>Yoon Ilsun</au><au>Hahm Sukgyu</au><au>Kim Dongouk</au><au>Chung Jaeseung</au><au>Park Joonyong</au><au>Shin Bongsu</au><au>Ok Jong G</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of forming aligned pattern in pattern formation region by using imprint process</title><date>2018-01-02</date><risdate>2018</risdate><abstract>A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Method of forming aligned pattern in pattern formation region by using imprint process |
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