Method to optimize general-purpose input/output interface pad assignments for integrated circuit

The present disclosure relates to an innovative method of assigning signals to general-purpose input/output pads of an integrated circuit chip. An inductance matrix for the input/output pads is obtained. A candidate assignment is made of a differential signal to a pair of the input/output pads, and...

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Bibliographische Detailangaben
Hauptverfasser: Foo Loke Yip, Oh Kyung Suk, Chin Mei See, Yew Yee Huan, Lee Wai Ling, Teng Hui Lee, Loh Chooi Ian, Tan Chee Cheong
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure relates to an innovative method of assigning signals to general-purpose input/output pads of an integrated circuit chip. An inductance matrix for the input/output pads is obtained. A candidate assignment is made of a differential signal to a pair of the input/output pads, and a differential mutual inductance is determined for each open pad location in relation to the pair of input/output pads. Single-ended signals are assigned to open pad locations having the lowest differential mutual inductances. The jitter contribution due to each assigned single-ended signal is computed, and a total jitter is updated. In a first embodiment, said assigning, computing and updating steps are repeated until the total jitter exceeds a total jitter budget. In a second embodiment, said assigning, computing and updating steps are repeated until a number of assigned single-ended signals is equal to a target number. Other embodiments and features are also disclosed.