Solid, self-bondable isocyanate-containing organic polymers and methods for using same

Solid, non-melting polyurethanes having a glass transition temperature of at least 40° C. and free isocyanate groups are self-bonding materials that are useful in a variety of adhesive and molding operations. Under conditions of heat and moisture, these polyurethanes will self-bond. The polyurethane...

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Bibliographische Detailangaben
Hauptverfasser:	Aou Kaoru, Latham Dwight D, Medina Juan Carlos
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON DYES INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Solid, non-melting polyurethanes having a glass transition temperature of at least 40° C. and free isocyanate groups are self-bonding materials that are useful in a variety of adhesive and molding operations. Under conditions of heat and moisture, these polyurethanes will self-bond. The polyurethanes can be used as adhesive coatings, which are solid and non-tacky and thus can be transported and stored easily under ambient conditions. These polyurethane adhesives are especially useful in applications in which, due to the location and/or orientation of the substrates, liquid or melting materials cannot be applied easily or will run off the substrates.