Semicondcutor structure and semiconductor manufacturing process thereof

Semicondcutor structure and semiconductor manufacturing process thereof

A semiconductor structure has a semiconductor device, a first seal ring, and a second seal ring. The semiconductor device has a first surface and a second surface opposite to the first surface. The first seal ring is disposed on the first surface of the semiconductor device and adjacent to edges of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Tsai Pei-Shing, Wang Rung-De, Hsieh Wei-Lun, Liu Chen-Hsun, Ku Chin-Yu, Wang Chia-Hua, Chen Jheng-Hong
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor structure has a semiconductor device, a first seal ring, and a second seal ring. The semiconductor device has a first surface and a second surface opposite to the first surface. The first seal ring is disposed on the first surface of the semiconductor device and adjacent to edges of the first surface. The second seal ring is disposed on the second surface of the semiconductor device and adjacent to edges of the second surface. A semiconductor manufacturing process is also provided.