SSD including a case, securing element, circuit board, and at least one package, and methods of forming the SSD

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a...

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Bibliographische Detailangaben
Hauptverfasser: Kim Hongkyun, Bang Hyojae, Jeon Youngbok, Kim Dogeun
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.