Lab-on-a-chip fabrication method and system

A method for fabrication of a lab-on-a-chip system makes use of first and second mold parts, which are adapted to join each other to form a cavity to accommodate a positioning means and a support structure. The method includes receiving the chip in the positioning means, forming the cavity by joinin...

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Bibliographische Detailangaben
Hauptverfasser:	Andreassen Erik, Mielnik Michal Marek, Tofteberg Terje Rosquist
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TESTING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method for fabrication of a lab-on-a-chip system makes use of first and second mold parts, which are adapted to join each other to form a cavity to accommodate a positioning means and a support structure. The method includes receiving the chip in the positioning means, forming the cavity by joining the first and second mold parts, securing the chip with a fluid port of the chip to rest on the support structure for the support structure to mask the fluid port, introducing a molding material into the cavity to over-mold at least part of the chip and a volume extending away from the chip, separating the first and second mold parts, and extracting the chip from the mold. A fluid channel is formed by the support structure.