Semiconductor device and method for manufacturing same

A semiconductor device (1001) includes an oxide semiconductor layer (7) and a conductor layer (13a, 13b, 13c, 13s) supported on a substrate (1). The oxide semiconductor layer (7) contains a first metallic element. The conductor layer (13a, 13b, 13c, 13s) has a multilayer structure including a first...

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Bibliographische Detailangaben
1. Verfasser: Kitakado Hidehito
Format: Patent
Sprache:eng
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Zusammenfassung:A semiconductor device (1001) includes an oxide semiconductor layer (7) and a conductor layer (13a, 13b, 13c, 13s) supported on a substrate (1). The oxide semiconductor layer (7) contains a first metallic element. The conductor layer (13a, 13b, 13c, 13s) has a multilayer structure including a first metal oxide layer (m1) containing the first metallic element, a second metal oxide layer (m2) on the first metal oxide layer, the second metal oxide layer (m2) containing an oxide of a second metallic element, and a metal layer (M) on the second metal oxide layer, the metal layer (M) containing the second metallic element. The first metal oxide layer (m1) and the oxide semiconductor layer (7) are made of the same oxide film. When viewed from the normal direction of the substrate 1, the first metal oxide layer (m1) and the oxide semiconductor layer (7) do not overlap.