Light emitting device and sealing layer for the light emitting device

Light emitting device and sealing layer for the light emitting device

A emitting device includes: an LED chip mounted on a substrate; and a sealing layer that encloses the LED chip, wherein: the sealing layer is a single layer having a thickness of from 0.1 mm to 1.0 mm and a maximum width of from 6.0 mm to 20 mm; and the sealing layer is composed of a methylsilicone...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Yano Yuichi, Ito Yuhki
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A emitting device includes: an LED chip mounted on a substrate; and a sealing layer that encloses the LED chip, wherein: the sealing layer is a single layer having a thickness of from 0.1 mm to 1.0 mm and a maximum width of from 6.0 mm to 20 mm; and the sealing layer is composed of a methylsilicone composition and the mole percentage (mol %) X of Si-CH3 in the methylsilicone composition is more than 90 and less than 100.