Thermally conductive ceramic-polymer composite and method of preparing the same

Provided are a thermally conductive ceramic-polymer composite in which thermoplastic polymers form a matrix, and planar fragments of thermally conductive ceramic or thermally conductive ceramic powder is uniformly dispersed on a grain boundary between thermoplastic polymer particles, thereby forming...

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Bibliographische Detailangaben
Hauptverfasser:	Seo Keum Suk, Choa Yong Ho, Hussain Manwar, Yoon Austin Pil Joong, Kim Gyunbok, Ryu Seunghan
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON DYES INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MAKING GRANULES OR PREFORMS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Provided are a thermally conductive ceramic-polymer composite in which thermoplastic polymers form a matrix, and planar fragments of thermally conductive ceramic or thermally conductive ceramic powder is uniformly dispersed on a grain boundary between thermoplastic polymer particles, thereby forming a thermal pathway, wherein the thermoplastic polymer particles are formed in a faceted shape, and the average size of the planar fragments of thermally conductive ceramic or thermally conductive ceramic powder is smaller than 1/10 of that of the thermoplastic polymer particles, and a method of preparing the same. Accordingly, since dispersion and interfacial affinity of a thermally conductive ceramic filler are maximized, excellent electrical insulation and excellent thermal conductivity can be exhibited even with a small content of the thermally conductive ceramic filler.