Method and apparatus for substrate rinsing and drying

A method and apparatus are disclosed for optimizing a rinsing and drying process in semiconductor manufacturing. The optimization seeks to maximize processing throughput while maintaining low defect counts and high device yields, and utilizes simulation and experimental data to set the optimal proce...

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Bibliographische Detailangaben
Hauptverfasser: Fonseca Carlos A, Carcasi Michael A
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method and apparatus are disclosed for optimizing a rinsing and drying process in semiconductor manufacturing. The optimization seeks to maximize processing throughput while maintaining low defect counts and high device yields, and utilizes simulation and experimental data to set the optimal process parameters for the rinsing and drying process. Improved methods of rinse liquid and purge gas nozzle movement are also disclosed.