Buffered adhesive compositions for skin-adhering medical products

Provided are buffered adhesive compositions comprising a high molecular weight non-neutralized polymeric acid and a high molecular weight partially neutralized polymeric acid and products such as wound dressings and ostomy skin barriers incorporating the compositions.

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Bibliographische Detailangaben
Hauptverfasser: Murahata Richard Iwao, Taylor Michael Gerard
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Provided are buffered adhesive compositions comprising a high molecular weight non-neutralized polymeric acid and a high molecular weight partially neutralized polymeric acid and products such as wound dressings and ostomy skin barriers incorporating the compositions.