Low cost CMOS chip with tape automated bonding (polyamide)

In view of the foregoing, an embodiment herein provides a low cost system. The system includes a bipolar array, a CMOS chip. The bipolar array includes one or more bipolar integrated circuits. The CMOS chip is programmed by a single level of metal. The bipolar array and the CMOS chip is mounted on a substrate using TAB polyamide. The TAB includes a polyamide film with one or more metal patterns chemically etched by programming three metal layers simultaneously to obtain one or more components. The one or more components are mounted in a package, and a small system can be realized. An external capacitor supplies an ac power source to the bipolar array. The bipolar array produces a rectified voltage and a lower voltage power for the enhanced gate array. An output of the enhanced gate array drives bipolar drivers of DC motor, stepper motor, BLDC motor, and LED assemblies.