Molding device and molding method using the molding device

A molding device which can heat molding portions of dies by a simple structure while guaranteeing the durability of the molding portions of the dies, and a method of molding a product using the molding device are provided. A molding device 100 includes a first die 110 and a second die 120 for moldin...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Takai Mitsuo
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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