Molding device and molding method using the molding device

A molding device which can heat molding portions of dies by a simple structure while guaranteeing the durability of the molding portions of the dies, and a method of molding a product using the molding device are provided. A molding device 100 includes a first die 110 and a second die 120 for moldin...

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Bibliographische Detailangaben
1. Verfasser:	Takai Mitsuo
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A molding device which can heat molding portions of dies by a simple structure while guaranteeing the durability of the molding portions of the dies, and a method of molding a product using the molding device are provided. A molding device 100 includes a first die 110 and a second die 120 for molding a product PR to be molded. The first die 110 and the second die 120 have a first molding portion 111 and a second molding portion 121 formed at central portions of the surfaces which face each other. Each of the first molding portion 111 and the second molding portion 121 has a three-dimensional shape corresponding to the surface shape of the product PR. Thermal/electrical insulators 113 and 124 are provided around the first molding portion 111 and the second molding portion 121 of the first die 110 and the second die 120. An electrical power supply apparatus 136 is connected to the first die 110 and the second die 120 through input/output electrodes 132 and 133, and the first die 110 and the second die 120 can be electrically connected together through connection electrodes 134 and 135 and electrically disconnected from each other.