Lead frame and method for manufacturing the same
A metal plate 1 to be a lead frame has a plating with Sn or Zn or a plating with various alloys containing these metals only on the side faces and half-etched faces 6, and a noble metal plating layer formed on the front surface as a surface on which a semiconductor device is to be mounted.
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A metal plate 1 to be a lead frame has a plating with Sn or Zn or a plating with various alloys containing these metals only on the side faces and half-etched faces 6, and a noble metal plating layer formed on the front surface as a surface on which a semiconductor device is to be mounted. |
|---|