Multi-chip package having encapsulation body to replace substrate core

A multi-chip package having no substrate is presented. The multi-chip package includes a chip stacked assembly, a first redistribution layer, a plurality of wire bonds, a plurality of metal pillars, an encapsulation, a second redistribution layer, and a plurality of vertical interposers. The first redistribution layer and the second redistribution layer are used in place of a substrate to reduce the thickness of the multi-chip package. In this way, a package-on-package device formed using the multi-chip package has a reduced thickness.