Context-based inspection for dark field inspection

Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered desi...

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Bibliographische Detailangaben
Hauptverfasser:	Gao Lisheng, Luo Tao, Zhang Yong, Chen Stephanie, Wu Chaohong
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING HANDLING RECORD CARRIERS IMAGE DATA PROCESSING OR GENERATION, IN GENERAL PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.