Method of dicing a wafer

A method of dicing a wafer includes providing a wafer and etching the wafer to singulate die between kerf line segments defined within an interior region of the wafer and to singulate a plurality of wafer edge areas between the kerf line segments and a circumferential edge of the wafer. Each one of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ortner Joerg, Roesner Michael, Stranzl Gudrun, Rothmaler Rudolf
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of dicing a wafer includes providing a wafer and etching the wafer to singulate die between kerf line segments defined within an interior region of the wafer and to singulate a plurality of wafer edge areas between the kerf line segments and a circumferential edge of the wafer. Each one of the plurality of wafer edge areas is singulated by kerf lines that each extend between one of two endpoints of one of the kerf line segments and the circumferential edge of the wafer.