Mask frame assembly for thin layer deposition, a method of manufacturing the same, and a method of manufacturing display apparatus by using a mask frame assembly

A mask frame assembly including a frame including a first opening, a first mask including second openings that each has an area smaller than the first opening and a first surface having portions of the first surface connected to the frame. The mask frame assembly includes second masks disposed on a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Lee Sangshin, Ko Junhyeuk
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A mask frame assembly including a frame including a first opening, a first mask including second openings that each has an area smaller than the first opening and a first surface having portions of the first surface connected to the frame. The mask frame assembly includes second masks disposed on a second surface of the first mask extending across the first opening in a first direction and arranged in a second direction that is substantially perpendicular. The second masks include pattern parts having a shape corresponding to the second openings. The pattern parts each include pattern holes configured to allow a deposition material to pass through. The second masks include a rib part disposed between the pattern parts. The rib part includes dummy holes each having an area greater than each of the pattern holes. The first mask is configured to block the deposition material passing through the dummy holes.