Semiconductor manufacturing apparatus

A semiconductor device manufacturing apparatus for encapsulating with a resin a semiconductor chip includes upper and lower molds configured to receive therebetween a lead frame on which the semiconductor chip is mounted. A positioning pin provided to the lower mold is configured to be received by a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Terui Yasuo, Akino Masaru
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A semiconductor device manufacturing apparatus for encapsulating with a resin a semiconductor chip includes upper and lower molds configured to receive therebetween a lead frame on which the semiconductor chip is mounted. A positioning pin provided to the lower mold is configured to be received by a positioning hole provided in the lead frame. Ejector pins provided in proximity to the positioning pin are arranged so as to be symmetrical with respect to the positioning pin.